Jay A. Williams serves as a Transducer Engineer at the NIH Resource Center for Medical Ultrasonic Transducer Technology.  Mr. Williams joined the group in March 2002 just prior to their move to the University of Southern California in August of that year.  He has also been the webmaster for the Resource Center since the move to Los Angeles, CA.  Some of his accomplishments include: 64 element 30MHz piezo-composite linear arrays with 100µm pitch, 256 element 30MHz piezo-composite linear arrays with 50µm pitch, 64 element 35MHz piezo-composite linear arrays with 50µm pitch, 8 element 40-50MHz copolymer annular arrays, very light-weight (<0.3 gram 40-60MHz, <0.2 gram 80-100MHz) high frame rate b-scan transducers, 10MHz composite HIFU catheter transducers, and high-frequency (>25MHz) fine-scale piezo-composites.  He currently has a patent pending through the USC Office of Technology Licensing covering techniques that improve the uniformity and performance of interdigital bonded composites, USC file 3829.

Mr. Williams has audited courses in Business Management, Computer Science, Mechanical Engineering, Architecture, and Physics at the Pennsylvania State University, 1975-1977.  He also achieved honors in both Analog Electronics at Radio Semiconductor, 1984, and Digital Electronics at Control Data Institute Multi-skills Center, 1987.  He had worked in industry for 25 years in a variety of technical fields such as Mass Spectrometry, Microwave Telecommunication, Liquid Chromatography, Digital Electronics, Ultrasound, and Information Technology.  From 1990 through 2001 he worked in ultrasound at Blatek, Inc., State College, PA, serving 8½ years in engineering and 2½ years in management, including 5 years as the IS/IT Manager - Network Admin., and 2 years as the Quality System Manager in charge of establishing their first ISO 9001:1994 / FDA CGMP:1999 (21CFR820) quality system, similar to ISO 13485:1996.

His research interests are in novel techniques and tools for the design and fabrication of high-frequency transducers and arrays, development and fabrication of advanced fine-scale piezo-composites that provide superior performance, and innovative methods for utilizing information technology and systems to enhance the capabilities and accessibility of various technologies.